A METHOD FOR FINE BONDING WIRE DETECTION USING LIGHT DIFFRACTION

A Method for Fine Bonding Wire Detection Using Light Diffraction

In manufacturing industry, bonding wires are used to interconnect the pads of a semiconductor chip to terminals of a package containing the chip [1]. With increasing demand of fine wires, current detection apparatus encounters some limitations. In this paper, a method to detect breakage of fine bonding wires using diffraction of light is proposed, where a laser head generates the light beam, an...

Two capillary solutions for ultra-fine-pitch wire bonding and insulated wire bonding

In this article, the new challenges and requirements in wire bonding are discussed, the problems in ultra-fine-pitch wire bonding and insulated wire bonding are analyzed, and then two capillary solutions to the problems are presented. Actual bonding experiments using the new capillaries were carried out and the results were satisfactory. Compared to the standard design, a new capillary design h...

Wire bonding using copper wire

Purpose – This paper attempts to review recent advances in wire bonding using copper wire. Design/methodology/approach – Dozens of journal and conference articles published recently are reviewed. Findings – The problems/challenges such as wire open and short tail defects, poor bondability for stitch/wedge bonds, oxidation of Cu wire, strainhardening effects, and stiff wire on weak support struc...

Overview of wire bonding using copper wire or insulated wire

Wire bonding using copper or insulated wire leads to many advantages and new challenges. Research is intensively performed worldwide, leading to many new findings and solutions. This article reviews recent advances in wire bonding using copper wire or insulated wire for advanced microelectronics packaging. Journal articles, conference articles and patents published or issued recently are review...

Palladium - coated and Bare Copper Wire Study for Ultra - Fine Pitch Wire Bonding